Cellecta HiDECK Overlay-18 | from UFH Direct

HiDECK Overlay 18 Overlay Board | for High-Performance Underfloor Heating

Premium High-Density Board – Fast Heat-Up Times

The Cellecta HiDECK-18 Overlay Board is specifically designed to improve the performance of underfloor heating systems by offering excellent thermal conductivity and low thermal resistance. This ensures quick heat-up times, more even heat distribution, and greater energy efficiency in any home or commercial building. With only 18mm thickness, it helps reduce overall floor build-up while its robust construction eliminates common problems like warping or expansion found in chipboard alternatives. HiDECK-18 is also fully compliant with acoustic regulations, making it a great choice for those who want both warmth and noise reduction in their space.

Thanks to its tongue-and-groove design, the HiDECK-18 Overlay Board is quick and easy to install without screws and can be laid directly onto concrete, steel, or timber floors. It is also ready to accept a wide range of floor finishes, including tiles, laminate, vinyl, or carpet, making it a flexible solution for renovations or new builds. This combination of thermal efficiency, durability, and acoustic performance makes HiDECK-18 a popular choice for modern underfloor heating projects.